If you’re in the market for silicon wafer marking, SVM has a solution for you. The company offers both SEMI-standard and custom laser marking services, which enable wafer fabs to track their wafers as they progress through the manufacturing process.
Since laser marking does not damage the wafer’s surface, no residual effects exist. Add a sacrificial protective layer and a post-marking wafer cleaning service to shield the surface from debris.
Designed for precision and flexibility, KEYENCE of silicon wafer laser markers offers a wide range of features. Besides flexible cutting modes, these lasers feature adjustable beam spot size and speed for optimized mark quality.
Unlike other laser marking systems, KEYENCE’s YVO4 technology requires no re-calibration after a single use. The YVO4 technology is a hybrid of both high and low-frequency lasers.
To get the best results, it is necessary to improve the quality of the laser’s output. As the surface of a silicon wafer is highly sensitive to laser energy changes, even minor variations in the laser’s intensity cause a difference in the character’s morphology.
As such, high-quality silicon wafer laser marking can be a challenging process. Fortunately, new technologies have made it possible to overcome this challenge.
Besides offering a broad range of laser markers, KEYENCE also provides customized integration with rapid support response. With a KEYENCE laser, you can get various marking options, from barcodes to text.
Depending on the part’s material, different laser wavelengths help achieve distinct contrast, depth, and surface finish. The technology also ensures accurate registration for minor defects.
The XPS analysis used to determine the chemical composition of the silicon wafer surface also revealed a clear peak corresponding to C-C. The intensity of this peak decreased after laser grinding. The C-O peak was also detect.
These results showed that a simple technique could use to laser grind silicon wafers and provide highly efficient on-demand grinding. These insights allow silicon wafer laser marking to easily implemented for various applications.
Another feature of silicon wafer laser marking is that it uses no inks or chemicals. Since lasers are clean, they are better for the environment. In addition, they do not consume much energy.
So, if you’re looking for a new way to mark silicon wafers, a KEYENCE laser marking system is your best. It is precision and energy efficiency make it the best choice for silicon wafer marking.
For more than 40 years, lasers used for marking various materials, including metals, ceramics, plastics, glass, and wood. Today, lasers are use in semiconductors, automotive, and multiple industries. Here are some of the benefits of laser marking.
Lasers have low dispersion and high power. They also can modulate to produce a precise energy beam, which can remove material and leave an accurate mark without damaging adjacent areas.
The marking beam’s positioning may involve various techniques, including relatively positioning the wafer and adjusting the focus position. One step involves a pre-detected sag of the wafer or measurement of the location of the marking beam using a depth sensor. In another method, the wafer is translate along an axis to position the beam accurately. In either case, the laser beam is aim at the corresponding point in the wafer’s plane.
One example of a process employed in the laser-marking of silicon wafers involves marking the backside of the wafer. The laser beam may be focused on the rear of a 300-mm-wide wafer. This may require keeping several thousand articles on a 300-mm-wide wafer. This is possible because the die size may vary from 25 to 5 mm, and the circuitry density makes it difficult to place machine-readable marks.
Another way to use lasers in silicon wafer marking is to identify the locations of features on a silicon wafer. Lasers can re-arrange surface particles so that they can be easily read. The marking beam can also be used to differentiate different types of semiconductors. A laser can also mark various applications. Once a feature has been observed, the process is completed automatically.
Spectra-Physics for the silicon wafer laser marking method includes a beam positioning subsystem and an alignment system. These subsystems help minimize the variation of angular scanned marking beam position over a large field.
A telecentric lens system provides better than one spot diameter over an 80-mm area, which results in increased marking speed. The 30mm spot size is smaller than most wafer marking systems, but this is desirable to control resolution and contrast.
The main components of Hylax silicon wafer laser marking machines include the type of laser and lighting, optics path configuration, material handling, and host communication. Mechanical design and robust components are vital to the quality and reliability of Hylax machines.
Only elements with proven durability are use in Hylax laser marking machines. These advantages are why Hylax laser marking machines are the first choice of semiconductor manufacturers. Read on to learn more about the features and benefits of Hylax machines.
The market for wafer laser marking machines is highly concentrated, with major players base in the USA, Germany, China, and Korea. The report also features company profiles and competitive intelligence. The report explains the growth prospects and challenges of the industry.
It covers 151 pages of information. To read the complete essay, you can purchase it here. For further information, visit the Hylax website. The company has a customer support center, a technical support team, and an extensive website.
The Hylax silicon wafer laser marking process does not disrupt the surface of the silicon. The laser traces the surface of the silicon wafer with a color change just below the surface. This way, the silicon wafer remains in good condition. Laser marking process also uses dot matrix fonts, which minimize surface disruption. The laser marking process is also 100% permanent since it leaves no residual damage to the wafer surface.
The laser used in the Hylax silicon wafer laser marking process requires a unique wavelength, referred to as a wafer laser marker. A standard laser for semiconductor marking would penetrate the material. Hence, a special wavelength is need to avoid delamination.
Hyrax silicon wafer laser marking requires high pulse energy and a narrow window. If the marking process is to be reliable, the laser must be able to compensate for the variations in the package height.
As mentioned before, the marking process does not use inks or chemicals, making it safe for the environment. This technique also uses less energy than other methods of marking silicon. Therefore, it is a preferred choice for many semiconductor manufacturers.
It is a reliable and efficient way of keeping silicon wafer. So, what is the main advantage of Hylax silicon wafer laser marking? It’s the accuracy of the process, speed, and cleanliness of the resulting mark.
CO2 laser marking is a process that uses a high-energy beam to produce highly contrasted, high-contrast features on a variety of materials. Because CO2 lasers have the longest wavelength, they penetrate deep into many materials and can have a substantial thermal impact on surrounding structures. Because of this, CO2 laser marking is typically only performed on significant features with a large heat-affected zone.
The speed of CO2 lasers is not only limited to low-speed cutting but can also be adjusted according to the material to be marked.
For example, an air-cooled CO2 laser operates at 15-30 W and has a focused beam spot of 76 mm. The scanning speed is between 2.3-11.4 mm/s. A Pyrex glass plate is placed below the silicon chip for better results. The cutting depth increases with the number of passes and roughness. However, redeposits are a continuing challenge for thermal heating.
CO2 laser marking on silicon wafers requires micro-holes to be cut on the silicon surface. During this process, the laser’s pulse frequency, duty cycle, and pulse frequency are controlled to drill holes on a 525 mm silicon wafer. In addition, the entrance diameter is measured.
The cavity diameter produced in this experiment is close to the standard diameter. The model predicts an error of less than 10%.
The CO2 laser engraving process produces lateral and depth microstructures in various sizes. These features are also helpful in fabricating microfluidic reactors, molds for micro-pillars, and studies of 3D cell cultures.
Unlike conventional lithography, CO2 laser marking on silicon wafers offers many advantages. Aside from allowing for a high degree of flexibility, CO2 laser marking on silicon wafers can yield remarkably detailed micro-structures.
Due to the high power of CO2 lasers, CO2 laser marking on silicon wafers can produce magnificent holes with a minimum hole entrance diameter of 0.475 mm and a maximum hole diameter of 0.575 mm.
Silicon Specialist LLC can use this method for various applications, including serialization, dicing, and higher-class cleanrooms. The CO2 laser marking on silicon wafers is a cost-effective process, suitable for most IC manufacturing requirements.